Release dates of camera sensors used in Nothing Phone 3:
πΈ Rear Main 50MP with OIS
Omnivision OV50H β Jan 3, 2023
πΈ Ultrawide 50MP
Samsung JN1 β Jun 10, 2021
πΈ Periscope 50MP 3x Optical, 60x Digital
Samsung JN5 β Jun 27, 2024
π€³ Front 50MP
Samsung JN1 β Jun 10, 2021
πΈ Rear Main 50MP with OIS
Omnivision OV50H β Jan 3, 2023
πΈ Ultrawide 50MP
Samsung JN1 β Jun 10, 2021
πΈ Periscope 50MP 3x Optical, 60x Digital
Samsung JN5 β Jun 27, 2024
π€³ Front 50MP
Samsung JN1 β Jun 10, 2021
Snapdragon 8 Elite 2 ~ SM8850 π
3nm TSMC N3p
SM8850s
2nm Samsung SF2
Cheaper than TSMC and expected to be released next year or may be not.
#Qualcomm #Snapdragon8Elite2
3nm TSMC N3p
SM8850s
2nm Samsung SF2
Cheaper than TSMC and expected to be released next year or may be not.
#Qualcomm #Snapdragon8Elite2
Would you consider buying a Samsung Flagship if it comes with Qualcomm's Flagship Snapdragon chipset manufactured by Samsung instead of TSMC ? π€
#Samsung #Snapdragon
#Samsung #Snapdragon
AnTuTu V10 Performance Ranking of June 2025 is out.
π±Flagship
π RedMagic 10S Pro+ (Snapdragon 8 Elite Leading Version)
π±Sub-Flagship
π iQOO Z10 Turbo (Dimensity 8400 Full Blooded Edition)
#Snapdragon #MediaTek #AnTuTu #Antutu #RedMagic10SProPlus #iQOOZ10Turbo
π±Flagship
π RedMagic 10S Pro+ (Snapdragon 8 Elite Leading Version)
π±Sub-Flagship
π iQOO Z10 Turbo (Dimensity 8400 Full Blooded Edition)
#Snapdragon #MediaTek #AnTuTu #Antutu #RedMagic10SProPlus #iQOOZ10Turbo
Join TechOffice's main Chat/Discussion Group Androstuffs β€
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Xiaomi 16 Ultra
Xiaomi 16 Ultra Max
Xiaomi 16S Ultra
Xiaomi 16 Ultra Max
Xiaomi 16S Ultra
So a tipster -- Yogesh Brar got his hands on headphones 1 quite early before the launch and tweeted his 5 days review before the launch.
In return, Nothing Co-founder -- Akis called him and threatened him with legal actions alongside abusing him too which forced the tipster to delete the twitter thread on headphones 1 first impressions.
https://x.com/techbharatco/status/1940092227709260236
In return, Nothing Co-founder -- Akis called him and threatened him with legal actions alongside abusing him too which forced the tipster to delete the twitter thread on headphones 1 first impressions.
https://x.com/techbharatco/status/1940092227709260236
How are Smartphones, Processors, Laptops, and Software made?
Hereβs a quick look at the key stages for each (with software integration points!):
π± Smartphones:
- Idea/Concept
- Design & Prototyping
- EVT (Engineering Validation Test) β First hardware prototypes, basic software loaded
π Software integration begins here!
- DVT (Design Validation Test) β Improved prototypes, more complete software
- PVT (Production Validation Test) β Final hardware & software, ready for mass production
- Mass Production β Large-scale manufacturing
- Market Launch β Released to customers
π₯οΈ Processors :
- Idea/Architecture
- Design & Simulation
- RTL Coding (Register Transfer Level) β Hardware logic described in code
- Verification & Validation
- Tape-out β Final chip design sent to fabrication
π Firmware/drivers/test software used for validation after this!
- Fabrication β Chips made on silicon wafers
- Packaging & Testing β Quality check
- Mass Production β Chips produced at scale
- Integration β Chips go into devices
Hereβs a quick look at the key stages for each (with software integration points!):
π± Smartphones:
- Idea/Concept
- Design & Prototyping
- EVT (Engineering Validation Test) β First hardware prototypes, basic software loaded
π Software integration begins here!
- DVT (Design Validation Test) β Improved prototypes, more complete software
- PVT (Production Validation Test) β Final hardware & software, ready for mass production
- Mass Production β Large-scale manufacturing
- Market Launch β Released to customers
π₯οΈ Processors :
- Idea/Architecture
- Design & Simulation
- RTL Coding (Register Transfer Level) β Hardware logic described in code
- Verification & Validation
- Tape-out β Final chip design sent to fabrication
π Firmware/drivers/test software used for validation after this!
- Fabrication β Chips made on silicon wafers
- Packaging & Testing β Quality check
- Mass Production β Chips produced at scale
- Integration β Chips go into devices
Tech Office : Updates & Tech News ~1
How are Smartphones, Processors, Laptops, and Software made? Hereβs a quick look at the key stages for each (with software integration points!): π± Smartphones: - Idea/Concept - Design & Prototyping - EVT (Engineering Validation Test) β First hardware prototypesβ¦
π» Laptops:
- Concept/Market Research
- Design & Prototyping
- Component Selection
- EVT β First hardware prototypes, BIOS/OS loaded
π Software integration begins here!
- DVT β Improved prototypes, more complete software
- PVT β Final hardware & software, ready for mass production
- Mass Production β Large-scale manufacturing
- Market Launch β Released to customers
π οΈ Software:
- Idea/Requirements
- Design
- Development (Coding)
- Alpha Testing
- Beta Testing
- RC (Release Candidate) β Final test version before GA
- GA (General Availability) β Final release to all users
- Maintenance & Updates
Full forms:
EVT = Engineering Validation Test
DVT = Design Validation Test
PVT = Production Validation Test
GA = General Availability
RC = Release Candidate
RTL = Register Transfer Level
Tape-out = Final chip design sent to fab
π‘ Software is integrated and tested during EVT/DVT/PVT for hardware, and after tape-out for chips!
- Concept/Market Research
- Design & Prototyping
- Component Selection
- EVT β First hardware prototypes, BIOS/OS loaded
π Software integration begins here!
- DVT β Improved prototypes, more complete software
- PVT β Final hardware & software, ready for mass production
- Mass Production β Large-scale manufacturing
- Market Launch β Released to customers
π οΈ Software:
- Idea/Requirements
- Design
- Development (Coding)
- Alpha Testing
- Beta Testing
- RC (Release Candidate) β Final test version before GA
- GA (General Availability) β Final release to all users
- Maintenance & Updates
Full forms:
EVT = Engineering Validation Test
DVT = Design Validation Test
PVT = Production Validation Test
GA = General Availability
RC = Release Candidate
RTL = Register Transfer Level
Tape-out = Final chip design sent to fab
π‘ Software is integrated and tested during EVT/DVT/PVT for hardware, and after tape-out for chips!
Tech Office : Updates & Tech News ~1
Photo
Tecno Pova 7 series green color